RETICLE® IBSD
Angstrom Engineering’s ion beam sputter deposition system creates precise, highly dense, pure, and stable optical films.
广西科米瑞实验仪器设备有限公司生产销售 Angstrom Engineering RETICLE® IBSD，可提供产品参数、报价和售后服务咨询，价格面议。
← 返回产品列表Our Reticle® ion beam sputter deposition systems are designed and engineered to create precise optical films of the highest purity, density, and stability. Angstrom Engineering’s Reticle® systems provide a turn-key solution for those looking to realize any optical design into a high-performance film.
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Process Specific
Quantum Series
Perovskite Series
Indium Series
Reticle Ion Beam Sputter
Linear Sputter
2D Coatings
Space/Environmental Simulation
Glove Box Integration
When precision is paramount — RETICLE® delivers.
This is an ideal system for applications such as antireflective (AR) coatings, highly reflective (HR) coatings, coatings for laser diode bars, telecom optical filters, and vanadium oxide deposition.
Angstrom Engineering® designs and engineers each Reticle® platform to provide our partners in the optics community the ability to create the films they need with excellent purity, density, and uniformity, all in a highly repeatable and automated fashion.
Reticle® employs Ion Beam Sputter Deposition (IBSD), in which a focused beam of highly energetic ions is accelerated toward a target comprising the material to be deposited. Thoughtful design of the ion beam focusing optics confines the beam entirely to the area of the target, eliminating any risk of contamination.
The IBSD process creates a highly energetic flux of deposition material, leading to films with improved density, hardness, and surface roughness compared to those deposited by evaporation processes.
IBSD takes place in a high vacuum environment, minimizing noble gas inclusion in the deposited film and improving the environmental stability of the coating.
IBSD processes can also employ a secondary ion source for substrate cleaning and energetic assist, substrate heating for reactive deposition, and in-situ optical monitoring or ellipsometry for critical layer thickness termination.
Process Specific Advantages
Film Quality
Secondary Ion Source
All standard Reticle® platforms include an additional gridless end-Hall ion source with hollow cathode neutralizer.
The end-Hall source is optimized for substrate cleaning/etching, ion-assisted deposition, or reactive IBSD processes.
For processes that require deep substrate etching, a selection of gridded DC or RF-ICP ion sources is also available.
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