EVG ® 101

Advanced Resist Processing System

The perfect solution for single-wafer resist processing in R&D and small-scale production

The EVG101 resist processing system, which is fully compatible with EVG´s automated systems, performs R&D-type processes on a single chamber design. A compact layout with small footprint allows the user semi-automated processing of wafers on an industrial level for the development of new devices or processes.

Features

Wafer size ranges from small pieces, square and round substrates up to 300 mm

Automated spin or spray coating or developing with manual wafer load/unload

Quick and easy process transfer from research to production utilizing proven modular design and standardized software

Syringe dispense system for utilization of small resist volumes, including high-viscosity resists

Small footprint while maintaining a high level of personal and process safety

Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)

NRTL listed

Options: Uniform coating of high-topography wafer surfaces with OmniSpray® coating technology Wax and epoxy coating for subsequent bonding processes Spin-On-Glass (SOG) coating CoverSpin™ Technology Nozzle wash Edge handling Edge bead removal Backside rinse function Heated chuck for spray coating

Uniform coating of high-topography wafer surfaces with OmniSpray® coating technology

Wax and epoxy coating for subsequent bonding processes

Spin-On-Glass (SOG) coating

CoverSpin™ Technology

Nozzle wash

Edge handling