EVG ® 105
EVG 105
Stand-alone EVG®105 bake module for soft- or post-exposure bake processes
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说明
Bake Module
Stand-alone EVG®105 bake module for soft- or post-exposure bake processes
Softbake, post-exposure bake and hardbake steps can be performed on the EVG105 bake module. Controlled baking environment assures uniform evaporation and programmable proximity pins provide the best available control of resist hardening processes and temperature profiles.
Features
Stand-alone bake module
Up to 300 mm wafer size or up to four 100 mm wafers at the same time
Temperature uniformity ≤ ± 1 °C @ 100 °C, up to 250 °C bake temperature
Loading pins for manual and safe wafer loading/unloading
Timer for bake
Substrate vacuum (direct contact bake)
N 2 purge and proximity bake 0-1 mm distance wafer to heat plate optional
Irregular shaped substrates
FAQ
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