EVG ® 20
EVG 20
IR Inspection System。IR and bond strength measurement of bonded wafer stacks
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说明
IR Inspection System
IR and bond strength measurement of bonded wafer stacks
The EVG20 offers a fast inspection method, especially for fusion bonded wafers. A live image of the entire wafer via IR transmission allows void detection down to a radius of 500 µm which is a perfect match for fusion bonding processes. In addition, the infrared inspection system supports bond strength measurements using the Maszara method.
Features
IR live image
One-shot high-resolution inspection of the entire bonded wafer
Optional bond pin for live visualization of bond wave propagation
Fully automated bond strength measurement (Maszara test)
Void size detection down to 500 µm radius
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