EVG ® 320
EVG 320
Automated Single Wafer Cleaning System。Automated single wafer cleaning system for efficient removal of particles
广西科米瑞实验仪器设备有限公司生产销售 EV Group EVG 320，可提供产品参数、报价和售后服务咨询，价格面议。
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Automated Single Wafer Cleaning System
Automated single wafer cleaning system for efficient removal of particles
The EVG320 automated single wafer cleaning system handles wafers and substrates automatically between the process stations. The robot handling system ensures pre-alignment and loading of the wafers automatically in a cassette-to-cassette or FOUP-to-FOUP operation.
Features
Available for aqueous based cleaning applications such as silicon direct bonding
Available for solvent based cleaning applications such as post-debond cleans
Up to four cleaning stations
Fully automated cassette-to-cassette or FOUP-to-FOUP handling
Edge handling for double-sided cleaning processes available (option)
High-efficiency cleaning using 1 MHz megasonic nozzles or area transducers (option)
Advanced remote diagnostics
Prevents cross-contamination from back to front side
Fully software-controlled cleaning process
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