EVG ® 320 D2W
EVG 320 D2W
Automated Die Preparation and Activation System。Industry’s first commercially available hybrid bond activation and cleaning system for direct placement (DP) die-to-wafer (D2W) bon
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Automated Die Preparation and Activation System
Industry’s first commercially available hybrid bond activation and cleaning system for direct placement (DP) die-to-wafer (D2W) bonding.
The EVG320 D2W is a highly flexible platform that features a universal hardware/software interface to enable seamless integration with third-party pick-and-place die bonding systems. It also can operate as a stand-alone system depending on integration and line balancing requirements. The system incorporates EVG’s advanced cleaning and plasma activation technology, which is available across its industry-standard W2W fusion and hybrid bonding platforms and has been proven in hundreds of installed modules worldwide. It also features flexible substrate handling that can accommodate any type of die carrier or film frame that can support plasma activation, hybrid and fusion bonding cleanliness standards, and SECS/GEM standard support.
Features
Up to six process modules
Fully automated cassette-to-cassette or FOUP-to-FOUP handling
Universal die carrier input including film frame and customized carrier formats
Universal hardware/software interface to enable seamless integration with third-party pick-and-place die bonding systems
Industry standard cleaning and activation modules for fusion and hybrid bonding
光刻
纳米压印
键合 Hybrid and Fusion Bonding Systems Permanent Bonding Systems Layer Release Systems Temporary Bonding and Debonding Systems Die-to-Wafer Bonding Systems EVG®320 D2W GEMINI® FB for D2W EVG®40 D2W
Hybrid and Fusion Bonding Systems
Permanent Bonding Systems
Layer Release Systems
Temporary Bonding and Debonding Systems
Die-to-Wafer Bonding Systems EVG®320 D2W GEMINI® FB for D2W EVG®40 D2W
EVG®320 D2W
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