GEMINI ® FB

Automated Collective Die-to-Wafer Bonding System

High volume manufacturing system for collective die-to-wafer (Co-D2W) bonding

A promising approach for hybrid D2W bonding is collective D2W (Co-D2W). In Co-D2W bonding, multiple dies are transferred to the final wafer in a single process step. The manufacturing flow for the Co-D2W bonding process consist of four major segments: carrier preparation, carrier population, wafer bonding and carrier separation. The EVG Gemini FB configured for D2W bonding is a decisive element in the Co-D2W integration flow, enabling efficient cleaning and transfer of carrier mounted dies, bonding and carrier detachment in one system. The Gemini FB system is industry standard for both wafer-to-wafer as well as Co-D2W fusion and hybrid bonding.

Features

Flexible handling of wafer and customized die carriers

Industry standard SmartView® NT face-to-face bond aligner for carrier to device wafer alignment

Up to six pre-processing modules: Clean module LowTemp™ plasma activation module Alignment verification module Thermocompression bond module

Clean module

LowTemp™ plasma activation module

Alignment verification module

Thermocompression bond module

XT Frame concept for highest throughput with EFEM (Equipment Frontend Module)

Software interfaces and integrated metrology functions allowing feed-forward and feed-back loop for efficient D2W overlay optimization

光刻

纳米压印

键合 Hybrid and Fusion Bonding Systems Permanent Bonding Systems Layer Release Systems Temporary Bonding and Debonding Systems Die-to-Wafer Bonding Systems EVG®320 D2W GEMINI® FB for D2W EVG®40 D2W

Hybrid and Fusion Bonding Systems

Permanent Bonding Systems