HERCULES ®

Lithography Track System

The HERCULES ® is a high-volume platform integrating the entire lithography process flow in one system, reducing process footprint and operator support.

Based on a modular platform, the HERCULES combines EVG’s established optical mask alignment technology with integrated wafer cleaning, resist coating, baking and resist development modules. The HERCULES enables cassette-to-cassette processing of various wafer sizes. The HERCULES safely handles thick, highly bowed, rectangular, small-diameter wafers or even device trays. Precision top-side and bottom-side alignment as well as coating of sub-micron to ultra-thick (up to 300 microns) resists can be applied for interlayer and passivation applications. The superior alignment stage design achieves highly accurate alignment and exposure results at high throughput.

Features

Production platform combines all advantages of EVG’s precision alignment and resist processing systems in a minimized footprint

Versatile platform supports fully automated processing of various substrate shapes, sizes, highly warped mold wafers and even trays

Coating of up to 52,000 cP enables manufacturing of ultra-thick resist features of up to 300 microns in height

CoverSpinTM rotating cover for low resist consumption and optimized resist coating uniformity

OmniSpray® coating for optimized coating of high topography surfaces

NanoSpray® for coating and protection of via structures

Automated mask handling and storage

Optical edge exposure and/or solvent cleaning for edge bead removal

Fragile, thin or warped wafer handling of multiple wafer sizes with bridge-tool system

Rework sorting wafer management and flexible cassette system

Multi-user concept (unlimited number of user accounts and recipes, assignable access rights, different user interface languages)