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TAU UHV 4 Pocket Mini E Beam Evaporator

TAU UHV 4 Pocket Mini E Beam Evaporator

4 Pocket Mini Electron-Beam Source Sequential or Co-Evaporation Flux Monitoring Electrodes Water-Cooled From CF63 Mounting Flange 250C Bakeout Temperature Up to 800mm Length The...

品牌: Korvus Technology价格: 面议服务区域: 全国

广西科米瑞实验仪器设备有限公司生产销售 Korvus Technology TAU UHV 4 Pocket Mini E Beam Evaporator,可提供产品参数、报价和售后服务咨询,价格面议。

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Korvus TechnologyTAU UHV 4 Pocket Mini E Beam Evaporator产品图片

THE HEX SERIES HEX CLUSTER HEX MINI HEX UHV APPLICATIONS INSIGHTS Linkedin Youtube The HEX Series Why the HEX Series? HEX vs HEX-L vs HEX-XL HEX Steel Deposition Sources FISSION – Magnetron Sputtering TES – Thermal Boat Evaporation TAU – Electron Beam Evaporation ORCA – Low Temperature Evaporation Sample Stages Glovebox Integration Automation Software Customisations HEX Cluster HEX MINI HEX UHV HEX UHV TAU UHV Applications Thin-Film Solar Cells Optical Coatings Thin-Film Batteries Teaching and Training Reactive Sputtering Sample Preparation Lift-off ITO Coatings Insights Webinars Techniques Articles Videos Testimonials Publications About Us 4 Pocket Mini Electron-Beam Source Sequential or Co-Evaporation Flux Monitoring Electrodes Water-Cooled From CF63 Mounting Flange 250C Bakeout Temperature Up to 800mm Length The TAU UHV is a UHV-compatible four-pocket electron-beam evaporation source for thin-film deposition. The TAU UHV is the UHV version of our proprietary source. Configurable to different flange sizes and angles, the TAU UHV can be fitted to any existing deposition system. A compact and powerful tool for evaporating metals, the TAU UHV can evaporate up to four pockets simultaneously or sequentially. Each pocket can be equipped with crucibles or rods. The TAU UHV Mini 4 Pocket Electron Beam Evaporator Get In Touch To Discuss How The TAU Could Be Ideal For Your Application CONTACT US TAU E Beam FAQs What Is An Electron Beam In PVD? An electron beam (e-beam) in PVD (Physical Vapour Deposition) refers to a specific method used to deposit thin films or coatings onto substrates by utilising an electron beam to vaporise the material to be deposited. This technique is commonly used in various industries, such as semiconductor manufacturing, optics, and coatings for aerospace or automotive applications. How Does The TAU Differ From Typical E Beam Sources? What Are The Benefits Of The TAU Vs Typical E Beam Sources? What Are The Advantages Of Using E Beam Over Thermal Evaporation? The HEX Series of thin film deposition systems provide a unique, versatile range of deposition options for your research and implementation applications. No matter where your research takes you, the HEX Series will be by your side. At Korvus Technology we take your privacy seriously. Unit 1 Barnes Wallis Court Cressex Business Park Wellington Road, High Wycombe, Buckinghamshire, HP12 3PS sales@korvustech.com +44 1280 852096 © 2026 Korvus Technology | All Rights Reserved | Web Design by JWD

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