OAI Model 6000: Automated Front & Backside Mask Aligner System

产品说明

For Production Semiconductors, MEMS, Sensors, Advanced Packaging, IOT, Microfluidics

• Choose either topside or optional backside alignment which uses OAI’s customized advanced recognition pattern software. These Mask Aligners have OAI’s Advanced Beam Optics with better than ±3% uniformity and a throughput of 200 wafers per hour in first mask mode, which results in higher yields. The Series 6000 can handle a wide variety of wafers from thick and bonded substrates (up to 7000μ), warped wafers (up to 7 mm-10mm), thin substrates (down to 100μ thickness), and thick photo resist.
• With topside alignment of ±0.5μ, OAI’s enhanced Pattern Recognition Software delivers reliable, repeatable results. For backside alignment, the Model 6000 Mask Aligner has a stable optical train, long distance microscopes, and advanced auto-alignment software giving the most repeatable front to backside alignment accuracy. With superb process repeatability, the Series 6000 is the perfect solution for all production environments. For the total lithography process, the Model 6000 can be integrated seamlessly with cluster tools and OAI’s automatic mask changer. OAI’s Production Mask Aligners are the total package and are available also with UV LED Light Sources.
• Watch the OAI Model 6000 Mask Aligner in action >>
• Model 6000: Automated Front & Backside Mask Aligner System Datasheet

规格参数