scia Multi 300
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Multilayers by Magnetron Sputtering on 300 mm Wafers
The scia Multi 300 is designed to produce high quality multilayer coatings on wafers up to 300 mm by magnetron sputtering . The system can be equipped with up to 4 magnetrons, enabling high-precision multilayer stacks of up to 4 target materials without breaking the vacuum. The deposition of metal layers is just as possible as oxide and nitride layers. The cassette load lock with automatic substrate transfer and the system control ensures a completely automatic and recipe-controlled process.
Features & Benefits
Excellent uniformity over 300 mm substrate area
Synchronized orbital and spin rotation for uniform multilayer films on wafers
4 magnetrons, each with individual gas supply and shutter unit
Automatic cassette handling system with load lock
Substrate face-down orientation for minimized particle load
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Applications
Application Example: Manufacturing of GMR sensors by HZDR: Samples prepared on different substrate materials lead to the same sensor performance.
Left Picture: View of sensor under an angle with electron microscopy | Right: Comparison of several magneto-resistance curves on different substrate types
Gradient multilayer coatings of mirrors for soft X-ray and anti-reflective coatings
Multilayer stacks for EUV and X-ray mirrors
GMR and TMR based multilayer coatings
Multilayer coating for UV and VIS optics
Principle
Circular substrate movement across magnetrons, each orbital rotation completes one period of the stack
Compensation of individual emission profiles of the magnetrons by precalculating the orbital rotation profiles
Magnetron Sputtering utilizes plasma ion bombardment on a target to deposit thin films on the substrate surface.
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