XBS200
XBS200 is a universal, automatic wafer bonder platform, ideally suited for wafer sizes up to 200 mm. Discover now ➤
广西科米瑞实验仪器设备有限公司提供 SUSS XBS200 产品资料、选型咨询、供货报价和售后服务支持,价格面议。
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Designed for reliable results
Key Features of XBS200 Wafer Bonder
Sophisticated technology, unmatched versatility: The XBS200 is the ideal wafer bonder for high-quality, high-volume production.
Looking for more details? Please click below to download the technical datasheet and our product presentation with in-depth product information.
| 中文译文待人工复核:Sophisticated technology, unmatched versatility | 中文译文待人工复核:The XBS200 is the ideal wafer bonder for high-quality, high-volume production. |
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