XBS300
XBS300 W2W hybrid 键合 platform is designed for automated hybrid fusion 键合 of aligned 200mm and 300mm wafers. Discover now ➤
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A platform that adapts to your demand
Key Features of XBS300 W2W Hybrid 键合 Platform
The modular design of the XBS300 W2W allows for flexible configuration. Hardware upgrades – such as a temperature control unit, in-situ deflection measurement, or x/y/θ closed-loop stage control – can be easily installed, enabling alignment performance down to 100 nm.
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