LSA 201
Veeco’s LSA201 Laser Spike Annealing (LSA) System has the same architecture as the LSA101 but includes a patented micro chamber design which enables full-wafer ambient control i...
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← 返回产品列表：Veeco’s LSA201 Laser Spike Annealing (LSA) System has the same architecture as the LSA101 but includes a patented micro chamber design which enables full-wafer ambient control in a scanning laser system. The micro chamber is unique in that it does not require the use of a vacuum load-lock. The system is capable of running mixtures of any inert gases including forming gas. The LSA201 targets applications such as high k metal gate junction activation and nickel silicide formation. The LSA201 is well suited for processes at sub-20nm, such as interface engineering and material modification where ambient control is critical.
：Long wavelength, Brewster angle, p-polarized light for optimum within-die uniformity
：Closed-loop temperature feedback control to maintain tight temperature control
：Layout independent design ideal for processing both planer and FinFET devices
：Localized stress field with flexible dwell time enables low stress processing and reduced wafer breakage
| 型号 | LSA 201 |
|---|---|
| 产品类别 | Laser Spike Anneal System |
| Process node/application | 20nm, such as interface engineering and material modification where ambient control |
| Application | rface engineering and material modification where ambient control is critical |
| Technology | Laser Spike Annealing (LSA) System has the same architecture as the LSA101 but includes a patented micro chamber desig |
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