Phoenix
Production Capabilities。:The Phoenix® system is engineered for high throughput and maximum uptime in any fabrication environment, from pilot production to industrial-grade manufa
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:The Phoenix® system is engineered for high throughput and maximum uptime in any fabrication environment, from pilot production to industrial-grade manufacturing. Technologists and researchers rely on the Phoenix® for repeatable, highly accurate film deposition on flat and 3D substrates alike. And with support for up to six individual precursor lines, the Phoenix® delivers solid, liquid, or gaseous process chemistries depending on your thin film needs. A compact footprint and innovative design makes the Phoenix® the practical choice for those with batch production ALD requirements.
:Key features include:
:Precise software control of process parameters, including temperature, flow and pressure, for defect-free coatings on even the most sensitive substrates
:Patented ALD Shield™ vapor trap to prevent build-up of deposits and minimizes excess process gases from being exhausted into the environment
:Large process chamber accepts GEN 2.5 substrates, multiple wafer cassettes and larger 3D objects
:Low cost of ownership with minimal startup and operational costs
:Compact footprint that conserves valuable clean room space
:Standard recipes and ALD materials readily available
:Comprehensive support and services worldwide from technical team and PhD scientists
:CE, FCC, and CSA compliant with many built-in safety features
:Technical specifications
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