WaferEtch
WaferChek Endpoint – Optical endpoint enables accurate identification of etch endpoint to minimize undercut, improve throughput, and lower chemistry cost.
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:Hyperbolic arm scan control- User can tailor the dispense arm pattern to optimize etch uniformity
:Adaptive Spiking- Chemical concentration control to ensure stable etch rate batch to batch and within batch.
:High Volume Platform- 3300 series
:1 – 10 chamber modular system
:Low foot print- stacked chambers
:On board chemical supply
:Multiple wafer sizes- 50 to 300mm
:Multiple substrate types – Si, LiTaO3, Sapphire, Glass
:Manual load platform for R&D- ML
:Single chamber- manual load
:WaferEtch 3300 Series Platform Manual Load Platform
:As I/O counts increase and performance requirements become more stringent, the RDL line/space dimensions continue to shrink. To enable these smaller dimensions, superior process control is required. The WaferEtch platform meets these process requirements with WaferChek endpoint and hyperbolic dispense arm motion.
:Compound Semiconductor Etch and Silicon Thinning
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