Plasma Strip Type Systems

Plasma Surface Treatment

Plasma Backend

Configurations

80 Plus 2.45 GHz for chemical etch characteristic Strip type automation meets flat large plasma chamber

80 Plus IoN With RF 13.56 MHz for physical surface treatment via ion bombardment

80 Plus HS 2,45GHz for chemical etch characteristic Strip type automation with unique loadlock vacuum chamber and flat large plasma processing chamber

80 Plus HS IoN with RF 13.56 MHz for physical surface treatment via ion bombardement

The 80 PLUS and 80 PLUS HS plasma systems are automated solutions with ingenious load/unload automation to transport the strip type products or wafers in the plasma chamber. This system meets all requirements to eliminate operator errors and save human resources through high efficiency.

80 Plus

Fully automated strip handling

Advanced host-communication abilities

Broad variation of substrate dimensions possible

Preventing operator mistakes

80 Plus HS

Seamless production with parallel leadframe loading / unloading

The additional vacuum antechamber with magazine reduces the off-peak times

Unique jam detection

Prevention of operator errors and reduction of human intervention

Productivity: 200–800 units per hour (UPH)

80 Plus GIGA/IoN

GIGA 80 Plus HS

Download datasheet

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