EVG ® 880 LayerRelease™
Automated Layer Release System。The EVG®880 LayerRelease™ System is a fully automated system and enables precise release of layers from silicon carrier substr...
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EVG ® 805
Debonding System。Thin wafer debonding。The EVG805 is a system for debonding of temporary bonded and processed wafer stacks consisting of a device wafer, carri...
EVG ® 850 TB
Automated Temporary Bonding System。Fully automated temporary wafer bonding of a substrate on a rigid carrier
EVG ® 850 DB
Automated Debonding System。Fully automated debonding, cleaning and unloading of thin wafers
EVG ® 610 BA
Bond Alignment System。Manual bond alignment system for wafer-to-wafer alignment suitable for academia and industrial research
EVG ® 620 BA
Automated Bond Alignment System。Automated bond alignment system for wafer-to-wafer alignment for research and pilot production
EVG ® 6200∞ BA
Automated Bond Alignment System。Automated bond alignment system for wafer-to-wafer alignment for pilot and volume production
SmartView ® NT
Automated Bond Alignment System for Universal Alignment。Fully automated bond alignment system for universal alignment with proprietary method for micron-leve...
HistoCore SPECTRA ST Stainer
World Class Staining Quality and Consistency。The is a high throughput routine H&E stainer with the flexibility to process H&E and special stains simultaneous...
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Compact Systems
PlantScreen TM Compact System is conveyor-based integrated robotic solution for high-precision digital plant phenotyping and plant cultivation of small and m...
- 产品名称
- Compact Systems
- 产品线
- Phenotyping Systems
Field Systems
PlantScreen TM Field Systems are autonomous, semi-autonomous and manual mobile platforms for fast and accurate crop phenotyping in the field. The systems con...
- 产品名称
- Field Systems
- 产品线
- Phenotyping Systems
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