
OAI 200E DUV Mask Aligner
Extreme DUV Mask Aligner 170nm-200nm。OAI’S Model 200E DUV Mask Aligner performs all the functions of the tabletop Model 200 Mask Aligner but utilizes a 185nm...
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- 200E DUV Mask Aligner
材料表征、热分析、力学、粒度、表面和物性测试设备
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Extreme DUV Mask Aligner 170nm-200nm。OAI’S Model 200E DUV Mask Aligner performs all the functions of the tabletop Model 200 Mask Aligner but utilizes a 185nm...

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高分辨率X射线衍射(HRXRD)与X射线反射(XRR)系统,可实现非图案化外延薄膜的厚度、密度、表面/界面粗糙度、成分分布、应变、弛豫状态及倒易空间映射(RSM)的多维度表征。系统具备全晶圆映射能力,可覆盖直径达300mm的晶圆,适用于半导体制造的近厂(Near-Fab)应用场景。
X射线形貌(XRT)成像系统,可针对功率电子、光电子及5G/6G通信领域的核心半导体材料(碳化硅(SiC)、氮化镓(GaN)、砷化镓(GaAs)、磷化铟(InP)、氧化镓(Ga₂O₃))开展单晶缺陷可视化表征,支持直径达300mm的晶圆测试。
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一款新型全集成电子衍射仪,用于测量亚微米级晶体,支持从数据采集到晶体结构确定的体系化工作流程。产品线:Single Crystal、Electron Diffraction

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等离子体分析飞行时间质谱仪 (PP-TOFMS)可分析固体材料中化学成分随深度的分布,分析速度快,应用领域广, 是材料科学家理想的加工工具

辉光放电光谱仪通过等离子体溅射,逐层剥蚀得到样品中各元素随深度的分布,元素的检测范围广,多种功能的开发帮助在不同的应用领域中都能发挥作用

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HORIBA 是完整测试方案的提供者,可以按照客户要求提供发动机、电机、传动系和动力总成测试台架的交钥匙解决方案。搭建交钥匙台架的一种可能情况是实现 HORIBA 测试设备集成在一个集装箱测试试验室。
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