RIE Plasma Etching System RIE-10NR
RIE Plasma
反应离子刻蚀。Novel low-cost and high-performance。The RIE-10NR is a novel low-cost, high-performance, fully automatic reactive ion etching system which meets the most demanding proces
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反应离子刻蚀
RIE Plasma Etching System RIE-10NR
RIE Plasma Etching System RIE-10NRNovel low-cost and high-performance
The RIE-10NR is a novel low-cost, high-performance, fully automatic reactive ion etching system which meets the most demanding process requirements for non-corrosive gas chemistry. A computerized touch screen provides a user-friendly interface for parameter control and storage. The system enables accurate sidewall profile control and high etch selectivity between materials. With its sleek, compact design, the RIE-10NR requires minimal cleanroom space.
主要特点和优点
Processing up to ø220 mm (ø3” x 5, ø4” x 3, ø8” x 1)
Highly selective anisotropic etching meets demanding process requirements
Fully automatic “one-button” operation with full manual override
A computerized touch screen provides a user-friendly interface for parameter control and storage
Automatic pressure control that allows for precise control of process pressure independent of gas flow
Dry pump and system layout allow for ease of maintenance
The reliable and durable system with a global installed base of more than 400 systems
Etching of various materials such as Si, SiO2, SiN, Poly-Si, GaAs, Mo, Pt, Polyimide, etc.
Selective layer etching in failure analysis
Photoresist ashing, stripping, and descuming
Surface modification (wettability and adhesion improvement)
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