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XBC300 Gen2 SP 表面制备 集群系统

XBC300 Gen2 SP is your fully automated solution for sequential die-to-wafer hybrid 键合 on 200mm and 300mm substrates with third party hybrid bondern. Discover...

XBC300 Gen2 D2W/W2W Hybrid 键合 Platform

XBC300 Gen2 D2W/W2W is the only hybrid 键合 platform that integrates W2W, collective D2W, and sequential D2W 键合 in a single system. Discover now ➤

XBS200 Wafer Bonder

XBS200 is a universal, automatic wafer bonder platform, ideally suited for wafer sizes up to 200 mm. Discover now ➤

中文译文待人工复核：Sophisticated technology, unmatched versatility

中文译文待人工复核：The XBS200 is the ideal wafer bonder for high-quality, high-volume production.

XBS300 W2W Hybrid 键合 Platform

XBS300 W2W hybrid 键合 platform is designed for automated hybrid fusion 键合 of aligned 200mm and 300mm wafers. Discover now ➤

DB12T Debonder

DB12T is a state-of-the-art solution for mechanical peel-off de键合 at room temperature, perfectly suited for a wide range of thin wafer applications. Discover...

XBC300 Gen2 Debonder & Cleaner

XBC300 Gen2 is a versatile, room-temperature de键合 and 清洗 platform, designed to meet the requirements of 2.5D and 3D integration processes. Discover now ➤

XBS300 临时键合 platform

is designed for automated hybrid fusion 键合 of aligned 200mm and 300mm wafers. Discover now ➤

ACS200 Gen3 200mm Automated Coater & Developer

ACS200 Gen3 is the automated coating platform for 100 - 200 mm substrates with unmatched versatility for R&D and high volume production. Discover now ➤

ACS200Gen3 TE 200 mm Coater & Developer

The ACS200 Gen 3 TE is the fully automated platform for 200 mm substrates with robust performance and maximum throughput. Discover now ➤

中文译文待人工复核：State-of-the-art technology plus easy handling

中文译文待人工复核：the ACS200 Gen3 TE allows for accurate, flexible and robust operations and delivers ultimate throughput.

ACS300 Gen2 Automated Coater & Developer

ACS300 Gen2 is your fully automated, all-in-one-solution for sophisticated photolithography processing of 200 and, 300 mm wafers. Discover now ➤

AS8 Manual Spray Coater for High Topographies

The AS8 is the compact, semi-automated spin coater for wafers up to 200 mm with severe topographies for R&D and pilot production. Discover now ➤

ECD8 Semi-Automated Coater or Developer

The versatile coater or developer for wafers up to 200 mm: due to flexible modules, the ECD8 adapts to both R&D and small 系列 production. Discover now ➤