EVG ® 105
Stand-alone EVG®105 bake module for soft- or post-exposure bake processes
查看详情
EVG ® 120
Automated Resist Processing System。The is a fully automated resist processing system designed for both low-volume and high-volume manufacturing, supporting w...
EVG ® 150
Automated Resist Processing System。The is a fully-automated resist processing system providing highthroughput performance and supporting wafers up to 200 mm ...
HERCULES ®
Lithography Track System。The is a high-volume platform integrating the entire lithography process flow in one system, reducing process footprint and operator...
EVG ® 610
UV Nanoimprint Lithography System。Mask alignment system with UV Nanoimprint Lithography capability from small pieces up to 150 mm
EVG ® 620 NT
Smart NIL ® UV Nanoimprint Lithography System。Mask alignment system with UV Nanoimprint Lithography capability featuring EVG´s proprietary SmartNIL ® technol...
EVG ® 6200 NT
SmartNIL UV Nanoimprint Lithography System。Mask alignment system with UV Nanoimprint capability featuring EVG´s proprietary SmartNIL ® technology up to 150 mm
EVG ® 720
Automated SmartNIL ® UV Nanoimprint Lithography System。Full-field UV Nanoimprint Lithography system up to 150 mm utilizing flexible stamps, featuring EVG´s p...
EVG ® 7200
Automated SmartNIL ® UV Nanoimprint Lithography System。Full-field UV Nanoimprint Lithography system up to 200 mm utilizing flexible stamps, featuring EVG´s p...
EVG ® 7300
Multifunctional UV Nanoimprint Lithography System。Multifunctional UV Nanoimprint Lithography system up to 300mm featuring SmartNIL ® technology, lens molding...
EVG ® 7200 LA
Large-Area SmartNIL ® UV Nanoimprint Lithography System。UV Nanoimprint Lithography system for large area panels
HERCULES ® NIL
Fully Integrated SmartNIL ® UV-NIL Systems。fully integrated SmartNIL ® UV-NIL system up to 200 mm
EVG ® 770 NT
Step-and-Repeat Nanoimprint Lithography System。Step-and-Repeat Nanoimprint Lithography for Efficient Master Fabrication
EVG ® 501
Wafer Bonding System。Versatile manual wafer bonding system for academia and industrial research
EVG ® 510
Wafer Bonding System。Wafer bonding system for R&D or low-volume production - fully compatible with high-volume-manufacturing equipment
EVG ® 520 IS
Wafer Bonding System。Single or dual chamber wafer bonding system for low volume production
EVG ® 301
Single Wafer Cleaning System。R&D type single wafer cleaning system
EVG ® 320
Automated Single Wafer Cleaning System。Automated single wafer cleaning system for efficient removal of particles
EVG ® 810 LT
LowTemp™ Plasma Activation System。Low-temperature plasma activation system for SOI, MEMS, compound semiconductors and advanced substrate bonding
EVG ® 850 LT
Automated Production Bonding System for SOI and Direct Wafer Bonding
EVG ® 850
Automated Production Bonding System for SOI。Automated production bonding system for a wide range of fusion/molecular wafer bonding applications
GEMINI ® FB
Automated Production Wafer Bonding System。Integrated platform for high precision alignment and fusion bonding
BONDSCALE ®
Automated Production Fusion Bonding System。Enabling 3D Integration for More Moore
EVG ® 540
Automated Wafer Bonding System。Fully automated wafer bonding system for substrates up to 300 mm
第 137 / 474 页