600i Series
Precision Thin Film Deposition for High-Density Applications
广西科米瑞实验仪器设备有限公司生产销售 Kurt J. Lesker 600i Series,可提供产品参数、报价和售后服务咨询,价格面议。
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:Precision Thin Film Deposition for High-Density Applications
:The KDF 600i Series featuring models 603i, 643i, 643ix, 654i, and 654ix is purpose-built for sensitive thin film deposition processes. These systems are ideal for applications involving standard materials as well as those prone to particulate contamination. With advanced engineering and robust performance, the 600i Series exceeds the requirements for high-density device fabrication and other defect-sensitive environments.
:Performance & Process Capabilities
:Designed for multi-process sputtering, the 600i Series offers exceptional flexibility and throughput. The systems support vertical side sputtering with a compact footprint and a 13" x 13" pallet size. Substrate handling is streamlined with a dual-process load lock and optional robotic cassette-to-cassette transfer, ensuring particulate-free operation. These systems can accommodate a single 8" wafer or up to thirty-six 2" wafers, with optional gas delivery systems for enhanced reactive processing.
:Operators benefit from rapid substrate changeover thanks to multi-size capability; substrate sizes can be switched run-to-run using pallet-based configurations. Integrated optical measurement hardware allows real-time control of pallet temperature, while optional Residual Gas Analyzers (RGAs) monitor gas peaks and support fault detection.
:The 600i Series supports a wide range of cathode configurations to meet diverse material and process requirements including:
:Planar: RF and DC sputtering of all materials, targets bonded to copper backing plate
:Inset: Upsilon or Mu for DC sputtering of metals with enhanced utilization, targets clamped to cooling well
:Mark II: planar style cathode with optimized magnets for dielectric sputtering
:Magterial: planar style cathode with high strength magnets for sputtering magnetic materials
:LMM: Linear Moving Magnet, engineered for high-rate reactive processes, full-face erosion, and minimal particle generation
:Support & Customization
:KDF offers tailored engineering solutions to meet specific customer goals whether optimizing for throughput, ROI, or time to market. All existing KDF equipment is supported with upgrades and retrofits. As the OEM for MRC batch systems, KDF provides complete parts and service support worldwide.
:Model Highlights
:603i
:The 603i is optimized for materials that generate high particulate contamination. Its rough-pumped load lock enables fast exchange cycles, making it ideal for telecommunications, chip resistor, and resistor network manufacturing.
:643i
:Building on the 603i platform, the 643i adds a high-vacuum load lock with quartz heat lamps for improved process control. Its palletized batch area allows instant wafer size changes, supporting both front and back side GaAs wafer processing. KDF offers a wide range of optimized pallets for diverse applications.
:654i
:Designed for the telecommunications and compound semiconductor sectors, the 654i features four-target versatility. It delivers superior etch and deposition uniformity and supports high-speed batch processing for advanced microelectronic components.
:643ix & 654ix (x Series™)
:These models feature extended 17" cathodes for improved uniformity across the pallet. x Series™ cathodes are available in Planar™, Inset™, and RF/DC LMM™ configurations, offering enhanced performance for specialized applications.
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