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PRO Line PVD 75 Versatile Sputtering, Electron Beam, & Thermal Evaporation Thin Film Deposition System Platform

PRO Line PVD 75

Automate Your Lab.。:The Kurt J. Lesker Company ® PRO Line PVD 75 is the next generation thin film deposition system based on the workhorse PVD 75 platform. With more than 400 uni

品牌: Kurt J. Lesker价格: 面议服务区域: 全国

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PRO Line PVD 75 Versatile Sputtering, Electron Beam, & Thermal Evaporation Thin Film Deposition System Platform
说明规格FAQ

说明

:Automate Your Lab.

:The Kurt J. Lesker Company ® PRO Line PVD 75 is the next generation thin film deposition system based on the workhorse PVD 75 platform. With more than 400 units in service worldwide, the PVD 75 is a proven, robust, and versatile design. The PRO Line PVD 75 builds on the successes of the original design with improved system base pressures and pump down times. A technically superior chamber design, an industry best software control system with advanced programming capability, automatic substrate loading, and numerous features for optimized thin film performance are a few of the key advantages offered in this innovative, best of class design.

:PVD 75 Open Frame

:PVD 75 with Load Lock

:PVD 75 Dual Chamber

:Specifications

:Box Shaped 304L Stainless Steel Chamber

:Internal Dimensions: 15.25" Wide x 16.50" Deep x 24" High (387.4mm x 419.1mm x 609.6mm)

:Aluminum, O-Ring Sealed, Hinged, Front Access Door

:Deposition Techniques

:Thermal Evaporation

:Up To Four, 4" Individual Boats, Or Six 2" Boat Assemblies

:TORUS Magnetron Sputtering Sources

:Up To Six 2" or 3" Sources

:Up To Four 4" Sources

:Electron Beam Evaporation Source

:4 Pocket 8cc

:8 Pocket 12cc

:6 Pocket 20cc

:LTE10 Organic Deposition Sources

:Up to Two, 10cc Sources

:Deposition Orientation

规格

型号PRO Line PVD 75
Product categorySputtering System
KL-6 Electron Beam source100mm Wafer / <=+/-4%
KL-6 Electron Beam source150mm Wafer / <=+/-5%
Thermal Evaporation Source100mm Wafer / <=+/-5%
Thermal Evaporation Source150mm Wafer / <=+/-5%
技术规格 5PVD 75 with Load Lock
技术规格 6PVD 75 Dual Chamber
技术规格 7Box Shaped 304L Stainless Steel Chamber
技术规格 8Internal Dimensions: 15.25" Wide x 16.50" Deep x 24" High (387.4mm x 419.1mm x 609.6mm)

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技术规格 9Deposition Techniques
技术规格 10Thermal Evaporation

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