744i Series
High-Throughput Batch Processing for Large-Area Substrates。:KDF continues to lead the industry in developing reliable in-line sputtering systems engineered for versatility, high
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:High-Throughput Batch Processing for Large-Area Substrates
:KDF continues to lead the industry in developing reliable in-line sputtering systems engineered for versatility, high throughput, and low cost of ownership. The 744i Series is designed to meet the growing demand for processing larger substrates with greater efficiency. Built for high-density interconnects, 200 mm semiconductor wafers, OLEDs, and flat panel displays, the 744i delivers robust performance in a compact footprint.
:KDF systems are used across a wide range of industries, including mainstream silicon, emerging materials, optical communications, medical devices, and display technologies. Compared to cluster tools, KDF's in-line batch systems offer easier operation and maintenance, while delivering improvements in film uniformity, process stability, and overall equipment reliability.
:744i Series Highlights
:The 744i Series features a vertical side sputtering configuration with a 19 inch by 19-inch pallet size. Its compact design occupies less than one-third of the space required by competing systems. A high-vacuum load lock equipped with quartz heater lamps ensures efficient substrate degassing, while the system can process up to four 200 mm wafers or multiple smaller wafers simultaneously.
:Throughput for 200 mm wafer metallurgy is four times greater than that of the 600i Series. The system supports glass sizes up to Gen 2 and includes a pallet assist tool (PAT) for safe and repeatable handling of payloads up to 60 pounds. Optional features include a cassette-to-cassette robot for particulate-free substrate transfer, an integrated RGA for gas peak monitoring, and a rotating substrate pallet for optical applications.
:The main chamber accommodates four targets and supports instantaneous wafer size changes. Users can process either the front or back side of the wafer, and the system is available with an optional 20 kW DC Pinnacle Plus configuration for pulse sputtering and pulse bias operations.
:System Benefits
:KDF's sputtering solutions are designed to enhance operational efficiency and deliver measurable gains in:
:Film uniformity
:Run-to-run throughput
:Process stability
:Return on investment
:Environmental health and safety
:KDF works closely with customers to develop tailored solutions that meet specific production goals. Whether optimizing throughput, ROI, or time to market, KDF provides upgrade paths and retrofit options for all existing equipment. As the OEM for MRC batch systems, KDF also offers full support for legacy MRC products, including parts and services on a global scale.
:Cathode Options
:The 744i Series supports a wide range of cathode configurations to meet diverse material and process requirements.
:Planar: RF and DC sputtering of all materials, targets bonded to copper backing plate
:Inset: Upsilon or Mu for DC sputtering of metals with enhanced utilization, targets clamped to cooling well
:Mark II: planar style cathode with optimized magnets for dielectric sputtering
:Magterial: planar style cathode with high strength magnets for sputtering magnetic materials
:LMM: Linear Moving Magnet, engineered for high-rate reactive processes, full-face erosion, and minimal particle generation
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