844i Series
High-Throughput Batch Sputtering System for Large-Area Substrates
广西科米瑞实验仪器设备有限公司生产销售 Kurt J. Lesker 844i Series,可提供产品参数、报价和售后服务咨询,价格面议。
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:High-Throughput Batch Sputtering System for Large-Area Substrates
:The KDF 844i Series is a large-area, four-target RF/DC batch sputtering system. It's designed for high-performance processing of high-density interconnects, 300 mm semiconductor wafers, OLEDs, flat panel displays, and solar cells. It supports glass sizes up to Gen 3.5 and offers a compact footprint. This makes it ideal for high-throughput production in space-constrained environments.
:844i Series Highlights
:The 844i offers a 26.5" x 30" pallet size. It can handle up to four 300 mm wafers or multiple smaller wafers per batch. A dual pallet system allows front and backside processing. Wafer sizes can be changed instantly, improving flexibility. Despite its capacity, the system uses less than one-third the floor space of comparable tools. A high-throughput load lock with substrate pre-heat boosts productivity. The through-the-wall design supports cleanroom integration. An optional OPUS™ robot enables particulate-free cassette-to-cassette handling.
:Engineered for Your Process
:The 844i Series is ideal for silicon, emerging materials, displays, optics, and medical devices. It offers high throughput, low cost of ownership, and simplified maintenance. Automation and reliability are built in. KDF provides global support and upgrade paths for all systems, including legacy MRC batch tools.
:Cathode Technology
:The system also features KDF's latest cathode designs, extended to 31 inches for improved uniformity across the entire pallet including:
:Planar: RF and DC sputtering of all materials, targets bonded to copper backing plate
:Inset: Upsilon or Mu for DC sputtering of metals with enhanced utilization, targets clamped to cooling well
:Mark II: planar style cathode with optimized magnets for dielectric sputtering
:Magterial: planar style cathode with high strength magnets for sputtering magnetic materials
:LMM: Linear Moving Magnet, engineered for high-rate reactive processes, full-face erosion, and minimal particle generation
:Performance & Process Capabilities
:The 844i delivers up to 4x the throughput of the 600i/900i Series for 300 mm wafer metallurgy. Target utilization reaches up to 60%. It ensures excellent film uniformity and process stability. Scan velocity profiling is available for precise deposition control. Optional pulsed DC sputtering up to 20 kW is supported via Advanced Energy Pinnacle Plus™.
:Compliance & Options
:The 844i meets SEMI S2-0706 safety standards. A CE-compliant version is available for European installations. Documentation is provided in paper, cleanroom paper, or digital formats. The OPUS™ robot is available for clean handling. The system is upgradeable with enhanced cathodes, gas delivery systems, and software packages.
:System Specifications
:Specification
:Chamber Ultimate < 9 x 10 -8 torr
:< 9 x 10 -8 torr
:Chamber Leak Rate 25 min to 1 x 10 -4 torr
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