Incucyte ® SX5 活细胞分析仪
Incucyte® SX5 活细胞分析仪。配备了专利光学组件的全新 Incucyte ® SX5可以更加深入地分析每个样本的信息。专为 活细胞分析 设计的颜色多达 5 种，功能更强大
- 荧光通道
- 最多5个不同荧光通道，最多同时使用3个
- 物镜
- 4x、10x和20x物镜
- 培养容器
- 支持可互换托盘并兼容超过600种细胞培养容器
scia Cluster 200
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering more...。Ion Beam Sputtering
- 型号
- scia Cluster 200
- Product category
- Ion Beam Etching
- Available process modules
- CORE TECHNOLOGY MODULES; Magnetron Sputtering; Electron Beam Evaporation (EBE); Ion Beam Etching (IBE); ADD-ON MODULES; Plasma Enhanced Chemical Vapor Deposition (PECVD); Pre-Cleaning with Reactive Ion Etching (RIE)
scia Mill 150
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Mill 150
- Product category
- Ion Beam Etching
- Substrate size (up to)
- 150 mm dia.
- Substrate holder
- Water-cooled, helium backside cooling contact, substrate rotation 1 to 20 rpm, tiltable in-situ from 0° to 165° in 0.1° steps
scia Mill 200
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Mill 200
- Product category
- Ion Beam Etching
- Substrate size (up to)
- 200 mm dia.
- Substrate holder
- Water-cooled, helium backside cooling contact, substrate rotation 1 to 20 rpm, tiltable in-situ from 0° to 170° in 0.1° steps
scia Mill 300
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Mill 300
- Product category
- Ion Beam Etching
- Substrate size (up to)
- 300 mm dia.
- Substrate holder
- Water-cooled, helium backside cooling contact, substrate rotation 1 to 20 rpm, tiltable in-situ from 0° to 170° in 0.1° steps
scia Trim 200
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Trim 200
- Product category
- Ion Beam Trimming
- Substrate size (up to)
- 200 mm dia., all standard wafer sizes possible
- Substrate holder
- Water-cooled, helium backside cooling contact, electrostatic clamping without edge exclusion
scia Trim 300
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Trim 300
- Product category
- Ion Beam Trimming
- Substrate size (up to)
- 300 mm dia., all standard wafer sizes possible
- Substrate holder
- Water-cooled, helium backside cooling contact, electrostatic clamping without edge exclusion
scia Finish 1500
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Finish 1500
- Product category
- Ion Beam Trimming
- Substrate size (up to)
- 1500 mm dia., 400 kg
- Axis performance
- Max. velocity 0.15 m/s, max. acceleration 15 m/s²
scia Coat 200
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Coat 200
- Product category
- Ion Beam Sputtering
- Substrate size (up to)
- 200 mm dia.
- Substrate holder
- Water-cooled, helium backside cooling contact, substrate rotation 5 to 20 rpm, tiltable in-situ from 0° to 170° in 0.1° steps
scia Coat 500
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Coat 500
- Product category
- Ion Beam Sputtering
- Substrate size (up to)
- 500 mm x 300 mm, 300 mm dia. for rotation
- Substrate holder
- Linear movement from 0.1 mm/min up to 15 mm/s, rotation up to 300 rpm (max. 300 mm dia.)
scia Opto 300
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Opto 300
- Product category
- Ion Beam Sputtering
- Substrate size (up to)
- 300 mm dia.
- Substrate holder
- Substrate rotation up to 60 rpm, includes optical thickness monitor (OTM) and test glass changer
scia Multi 300
Products Ion Beam Etching Ion Beam Trimming Ion Beam Sputtering scia Cluster 200 more...
- 型号
- scia Multi 300
- Product category
- Magnetron Sputtering
- Substrate size (up to)
- 300 mm dia.
- Sputter source
- 4 or 6 rectangular magnetrons (381 mm x 89 mm)
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